3 multilayer organic (mlo tm ) 0805 wcdma diplexer mlo tm technology the 0805 diplexer is a best in class low profile multilayer organic passive device that is based on avx?s patented multilayer organic high density interconnect technology. the mlo tm diplexer uses high dielectric constant and low loss materials to realize high q passive printed passive elements such as inductors and capacitors in a multilayer stack up. the mlo tm diplexers can support multiple wireless standards such as wcdma, cdma, wlan, and gsm and are less than 0.6mm in thickness. these components are ideally suited for band switching for dual band systems. all diplexers are expansion matched to fr4 thereby resulting in improved reliability over standard si and ceramic devices. applications multiband applications including wcdma, wlan, wimax, gps, and cellular bands l and g rid a rray advantages ? low insertion loss ? excellent solderability ? low parasitics ? low profile quality inspection finished parts are 100% tested for electrical parameters and visual characteristics. operating temperature -40oc to +85oc termination finishes available in ni/sn, immersion sn, immersion au and osp coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. part number: DP05A19407TR specification @ 25oc size [mm(inches)] 2.12 x 1.28 (0.083 x 0.050) height [mm(inches)] 0.55 (0.021) volume (mm^3) 1.5 frequency range (f1) (mhz) 89268 frequency range (f2) (mhz) 1940230 insertion loss (f1, at fc) (db) -0.4 insertion loss (f2, at fc) (db) -0.65 attenuation (f1) at (f2) (db) -23 attenuation (f2) at (f1) (db) -20 vswr (input @ f1) 1.3 vswr (input @ f2) 1.4 vswr (lowband @ f1) 1.4 vswr (highband @ f2) 1.2 6 5 4 1 2 3 6 5 4 1 2 3 terminal no. terminal name 1 high frequency port 2gnd 3 low frequency port 4gnd 5 common port 6gnd power capacity 4.5w maximum a design 1940 frequency (mhz) 7 finish 7 = au t = nisn how to order dp type 05 size orientation in tape top view tr packaging tape & reel tr = 3 kpcs tr/500 = 500 pcs bottom view side view 0.200.10 (0.0080.004) 0.200.10 (0.0080.004) 2.120.20 (0.0830.008) 0.440.10 (0.0170.004) 0.550.10 (0.0220.004) 0.640.05 (0.0250.002) 0.040.04 (0.0020.002) 0.250.10 (0.0100.004) 1.280.20 (0.0500.008) 0.950.05 (0.0370.002) unit: mm (inches) 65 4 12 3 bottom view side view 0.200.10 (0.0080.004) 0.200.10 (0.0080.004) 2.120.20 (0.0830.008) 0.440.10 (0.0170.004) 0.550.10 (0.0220.004) 0.640.05 (0.0250.002) 0.040.04 (0.0020.002) 0.250.10 (0.0100.004) 1.280.20 (0.0500.008) 0.950.05 (0.0370.002) unit: mm (inches) component dimensions and functions http://www..net/ datasheet pdf - http://www..net/
4 multilayer organic (mlo tm ) 0805 wcdma diplexer s parameter measurements high band return loss low band return loss isolation 0 -5 -10 -15 -20 -25 -30 -35 db(s(1.1) db(s(3.1) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 freq, ghz db(s(2.3)) 0 -10 -20 -30 -40 -50 -60 db(s(1.1) db(s(2.1) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 freq, ghz -5 -10 -15 -20 -25 -30 -35 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 freq, ghz note: measurements were taken using an anritsu 4 port vna; diplexer was mounted on a custom evaluation board. to reduce systematic er rors from the vna, the coaxial measurement cables, and evaluation board, a short-open-load-thru (solt) calibration was performed, using a custom fabricated ca libration substrate. this is the most common coaxial calibration methods. http://www..net/ datasheet pdf - http://www..net/
multilayer organic (mlo tm ) 0805 wlan/bt diplexer automated smt assembly smt reflow profile the following section describes the guidelines for automated smt assembly of mlo tm rf devices which are typically land grid array (lga) packages or side termination smt pacages. control of solder and solder paste volume is critical for surface mount assembly of mlo tm rf devices onto the pcb. stencil thickness and aperture openings should be adjusted according to the optimal solder volume. the following are general recommendations for smt mounting of mlo tm devices onto the pcb. common ir or convection reflow smt processes shall be used for the assembly. standard smt reflow profiles, for eutectic and pb free solders, can be used to surface mount the mlo tm devices onto the pcb. in all cases, a temperature gradient of 3c/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. additional soak time and slower preheating time may be required to improve the out-gassing of solder paste. in addition, the reflow profile depends on the pcb density and the type of solder paste used. standard no-clean solder paste is generally recommended. if another type of flux is used, complete removal of flux residual may be necessary. example of a typical lead free reflow profile is shown below. profile parameter pb free, convection, ir/convection ramp-up rate (tsmax to tp 3oc/second max. preheat temperature (ts min to ts max) 150oc to 200oc preheat time (ts) 60 ? 180 seconds time above t l , 217oc (t l ) 60 ? 120 seconds peak temperature (tp) 260c time within 5oc of peak temperature (tp) 10 ? 20 seconds ramp-down rate 4oc/second max. time 25oc to peak temperature 6 minutes max. critical zone t l to tp ramp-down ramp-up ts max 25 t 25? to peak ts min ts preheat tp tp t l t l time temperature figure a. typical lead free profile and parameters 9 http://www..net/ datasheet pdf - http://www..net/
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